Sliver alloy AgCu28 bubuk kanggo printing 3D

Sliver alloy AgCu28 bubuk kanggo 3D printing Featured Image

Katrangan singkat:

Ag: Bal
Cu: 18, 28
Suhu kerja bubuk campuran perak-tembaga nganti 500 derajat Celsius. Wêdakakêna iki tansah digunakake kanggo nutupi sealing tahan nyandhang lan brazing.

Kirimi email kanggo kita

Detail Produk

Tag produk

Paduan SliverAgCu18 bubuk AgCu28kanggo printing 3D

Spesifikasi

wêdakakêna paduan salaka

1. Supplier lan pabrikan emas

2. rega pabrik China

3. Kemurnian dhuwur lan ukuran partikel kurang

4. Pangiriman pas wektune

5. Good sawise-sale layanan

bahan welding logam larang regane utamané ndherek lapangan brazing. Bahan patri kami kalebu paduan berbasis emas (Au), paduan berbasis perak (Ag), paduan berbasis platinum (Pt), paduan berbasis paladium (Pd), lan paduan berbasis tembaga (Cu ), paduan berbasis nikel ( Ni), alloy basis kobalt (Co), alloy basis titanium (Ti), lan sapiturute, digunakake digunakake ing aerospace, aviation, vakum listrik, microelectronics lan lapangan liyane. Wangun produk kalebu sutra, tape, foil, strip cor, bubuk, tempel, lsp.

Jeneng produk Diameter kawat Strip foil (ketebalan X lebar) /mm Ukuran bubuk/mesh Titik lebur/℃ Titik alir/℃ Suhu brazing/℃